Adhesion ability and interfacial thermal transfer capacity at soft/hard interfaces are of critical importance to a wide variety of applications, ranging from electronic packaging and soft electronics to batteries. However, these two properties are difficult to obtain simultaneously due to their conflicting nature at soft/hard interfaces. Herein, we report a polyurethane/silicon interface with both high adhesion energy (13535 J m^–2) and low thermal interfacial resistance (0.89 × 10^–6 m² K W^–1) by regulating hydrogen interactions at the interface. This is achieved by introducing a soybean-oil-based epoxy cross-linker, which can destroy the hydrogen bonds in polyurethane networks and meanwhile can promote the formation of hydrogen bonds at the polyurethane/silicon interface. This study provides a comprehensive understanding of enhancing adhesion energy and reducing interfacial thermal resistance at soft/hard interfaces, which offers a promising perspective to tailor interfacial properties in various material systems.

中文翻译：

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通过调节界面氢键相互作用设计具有高粘附能和低界面热阻的软/硬界面


软/硬界面的粘合能力和界面热传递能力对于从电子封装、软电子产品到电池的各种应用至关重要。然而，这两种特性很难同时获得，因为它们在软/硬界面上存在冲突。在此，我们报道了一种具有高粘附能（13535 J m ^–2 ）和低界面热阻（0.89 × 10 ^–6 m ² K W ^–1 ) 通过调节界面处的氢相互作用。这是通过引入大豆油基环氧交联剂来实现的，该交联剂可以破坏聚氨酯网络中的氢键，同时可以促进聚氨酯/硅界面处氢键的形成。这项研究提供了对增强粘合能和降低软/硬界面处的界面热阻的全面理解，这为定制各种材料系统的界面性能提供了一个有前景的前景。