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Fabrication of photothermal responsive dual-chamber microcapsules for self-healing epoxy anticorrosion coatings
Polymer ( IF 4.6 ) Pub Date : 2024-04-29 , DOI: 10.1016/j.polymer.2024.127113
Naipin Chen , Fang Wang , Jiajun Wang , Jiaqi Liu , Xinbao Zhu

It has been urgent that timely repair of microdamage generated during long-term service of metal insulation coatings. Hereby, we developed a novel self-healing dual-chamber microcapsule with particle size about 5 μm, in which furfuryl amine modified polystyrene-acrylic acid (PSAF) as shell material and photosensitizer Carbon dots (CDs) as Pickering emulsifier. The synthesized materials were characterized analytically, FTIR and DSC demonstrated the simultaneously existence of healing agent and curing agent in the resultant dual-chamber microcapsule. Experiments also showed microcapsules exhibited satisfying storage stability more than 20 d at room temperature as well as thermogenesis effect that allowing temperature of epoxy composite materials raised to 50 °C in 60s and fractures to be effectively minimized in time. The scratch tensile measurement results demonstrated that epoxy resin composites incorporated with 2 wt% microcapsules exhibited the optimal strength self-healing efficiency, modulus, toughness and anti-fatigue performance. Furthermore, surface characterization and EIS analysis also confirmed the long-lasting healing effect of EP/MC complex coating with outstanding corrosion resistance. Therefore, the photothermal responsive dual-chamber microcapsule designed in this work has application as self-healing material especially epoxy anti-corrosion coating.

中文翻译:


光热响应双室微胶囊自修复环氧防腐涂料的制备



金属绝缘涂层长期使用过程中产生的微损伤的及时修复已刻不容缓。为此,我们开发了一种粒径约为5μm的新型自修复双室微胶囊,其中糠胺改性聚苯乙烯丙烯酸(PSAF)为壳材料,光敏剂碳点(CD)为Pickering乳化剂。对合成材料进行了分析表征,FTIR和DSC证明了所得双室微胶囊中同时存在修复剂和固化剂。实验还表明,微胶囊在室温下表现出令人满意的20 d以上的储存稳定性,以及使环氧复合材料的温度在60秒内升至50℃的生热效应,并能及时有效地减少断裂。划痕拉伸测量结果表明,掺入 2 wt% 微胶囊的环氧树脂复合材料表现出最佳的强度自修复效率、模量、韧性和抗疲劳性能。此外,表面表征和EIS分析也证实了EP/MC复合涂层具有持久的修复效果,且具有出色的耐腐蚀性。因此,本工作设计的光热响应双室微胶囊具有作为自修复材料特别是环氧防腐涂料的应用。
更新日期:2024-04-29
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