Solution-based processing of two-dimensional (2D) materials has garnered significant interest as a facile and versatile route for the large-scalable production of 2D material films. Despite the benefits in process, these films were not considered suitable for device applications during the early stages of research because their electronic properties were far from those of 2D materials obtained through micromechanical exfoliation or chemical vapor deposition. Due to the small lateral dimensions and polydisperse thickness of constituent 2D nanosheets, the resulting film tends to be porous and exhibits numerous inter-sheet junctions, primarily contacting edge-to-edge. This nanosheet morphology leads to poor electrical conductivity of the network, and also hinders the film functioning as a semiconductor or an insulator. To produce ultrathin 2D nanosheets with narrow thickness distribution and large lateral sizes, various chemical exfoliation strategies have been explored, but these are limited by long process times, involvement of harsh chemicals, and/or undesired structural damage or phase changes. Recent breakthroughs in electrochemical exfoliation using tetraalkylammonium intercalants enabled the production of high-quality 2D nanosheets with structural characteristics favorable for producing ultrathin, conformal films of 2D materials, which allow for scalable production of high-performance electronic components that can readily be assembled into functional devices via solution-processing. In this review article, we aim to offer an extensive introduction solution-based processing techniques for acquiring 2D nanosheets, their subsequent assembly into thin films, and their diverse applications, primarily focusing on electronics and optoelectronics but also extending to other fields. Remaining challenges and potential avenues for advancement will also be discussed.

中文翻译：

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解决方案处理的 2D 范德华网络：制造策略、属性和可扩展设备应用

基于解决方案的二维 (2D) 材料加工作为大规模生产 2D 材料薄膜的简便且通用的途径引起了人们的极大兴趣。尽管在工艺上有好处，但这些薄膜在研究的早期阶段并不被认为适合器件应用，因为它们的电子性能与通过微机械剥离或化学气相沉积获得的二维材料相差甚远。由于二维纳米片的横向尺寸小且厚度多分散，所得薄膜往往是多孔的并表现出许多片间连接，主要是边缘到边缘的接触。这种纳米片形态导致网络的导电性较差，并且也阻碍了薄膜作为半导体或绝缘体的功能。为了生产具有窄厚度分布和大横向尺寸的超薄二维纳米片，已经探索了各种化学剥离策略，但这些策略受到长工艺时间、刺激性化学品的参与和/或不期望的结构损伤或相变的限制。最近在使用四烷基铵嵌入剂进行电化学剥离方面取得的突破使得能够生产高质量的二维纳米片，其结构特征有利于生产超薄、保形的二维材料薄膜，从而可以大规模生产易于组装成功能器件的高性能电子元件通过解决方案处理。在这篇评论文章中，我们的目标是广泛介绍基于解决方案的加工技术，用于获取 2D 纳米片、随后将其组装成薄膜及其多样化应用，主要集中在电子和光电子学，但也扩展到其他领域。还将讨论剩余的挑战和潜在的进步途径。